YAMAHA 3D high-speed solder paste printing inspection machine YSi-SP
Date：2020-11-20 Hits：784
A "high-speed universal integrated mounting head" suitable for various inspections, achieving high-precision and high-speed inspections such as 3D+2D inspection and resolution switching functions. A detailed and rich M2M (Machine to Machine) solution with rich SPC functions can achieve various statistical processing options suitable for various products
- Product Details
Basic specifications
YSi SP
Object substrate size L510mm × W460mm~L50mm × W50mm (monorail model)
※ Non dual track model
Horizontal resolution (FOV size) 1) 25 μ M/12.5 μ M (approximately 50 × 50mm)
2) 20 μ M/10 μ M (approximately 40 × 40mm)
3) 15 μ M/7.5 μ M (approximately 30 × 30mm)
※ All are standard selection formulas
High resolution 1 µ m
Check the printing status of solder paste for the project (volume, height, area, position offset)
Power specification single-phase AC 200/208/220/230/240V ± 10% 50/60Hz
Air supply does not require air
External dimensions (excluding protrusions) L904 × W1080 × H1478mm
The main body weight is approximately 550kg
